Microcryocooler for Wafer Scale Integration with Sensors

CRYOCOOLER MICROELECTROMECHANICAL MICRODYNAMICS INTEGRATED GENERAL PNEUMATICS CORP'S PRELIMINARY DESIGN FOR EMPLOYING MICRODYNAMICS TO PRODUCE MICROELECTROMECHANICAL CLOSED-CYCLE CRYOCOOLERS USING SILICON PROCESSING TECHNIQUES WILL BE USED FOR MAKING INTEGRATED CIRCUITS IN PHASE 1. MICROMINIATURE COOLERS WILL BE INTEGRATED AT THE WAFER SCALE WITH A WIDE VARIETY OF SENSORS AND OTHER COLD ELECTRONIC DEVICES TO MAKE UNITS OF MODEST COST AND HIGH RELIABILITY. DEVELOPMENT OF SELF-CONTAINED MICROCOOLERS FOR DIRECT INTEGRATION WITH AND FABRICATED LIKE WAFER SCALE ELECTRONICS WOULD BE AN ADVANCEMENT COMPARABLE TO THE DEVELOPMENT OF INTEGRATED CIRCUITS. SUCH DEVELOPMENT WOULD FACILITATE THE USE OF COLD ELECTRONICS IN CIVIL, MILITARY, SCIENTIFIC AND MEDICAL APPLICATIONS.