High Power Density Radiator Concept Using Short Staggered Heat Pipes Imbedded in Honeycomb Panels with High Conductivity Face Sheets (kTC P 208)

To meet the ever-increasing workloads, space and aerospace systems require higher power systems. As these more powerful systems emerge, radiator and heat spreader technology is becoming a limiting factor. In Phase I, k Technology (kTC) demonstratedenabling technology that allows more robust simpler component designs. Through analyses and hardware test, kTC showed that its high conductivity k-CoreTM could be used in high power radiator and heat spreader applications to reduce the number of, oreliminate, conventional heat pipes and make thermal components effective and less complex. In phase II of the effort, kTC will apply this technology to develop and qualify a radiator and a heat spreader component for specific MDA satellite and solidstate laser (SSL) efforts. kTC will develop a k-Core system tailored to the specific applications. To this end, in concert with MDA and system primes, kTC will develop specifications, qualification procedures, process development, and materialcharacterization required for flight systems. Then, kTC will design, fabricate, test, and qualify components.