SBIR/STTR Research Award
Fiber Optic Communication Ribbon
Award amount
$69,863Program and phase
SBIR · Phase IAward year
2003Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- FIBER SYSTEMS INTERNATIONAL
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- S7HXJ97WWKT5
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
The scope of this SBIR includes the analysis of fiber optic ribbon cable technology along with the preliminary design and analysis of miniaturized fiber optic connectors used for avionics inter-package communications. The technology for multi-gigabittransceivers will also be surveyed to determine potential transceivers for use in missile applications. The objective of this SBIR is to define requirements and show a proof of principle for a system consisting of fiber optic ribbon cable, miniaturizedfiber optic connectors, and transceiver technology that would be able to function in a missile environment. We envision a multi-channel fiber optic cable assembly that can be embedded into a composite material and be used to make connections between stages of a missile. Furthermore, provision shall be made for connecting from the missile's internal fiber opticcable harness to the fiber optic cable bus embedded in the composite solid rocket motor case. The successful execution of this SBIR will result in a new concept for multi-channel fiber optic cable assemblies. An optical interconnect solution that satisfies the technical challenges has a large number of potential applications in commercial aswell as military avionic applications. The invention of a new fiber optic connector and fiber optic ribbon cable technology designed specifically to meet the rigorous requirements associated with avionics applications would provide the necessarycomponents for widespread use of fiber optics in these challenging applications. The resulting systems would greatly benefit both commercial and military avionics through reduced cost, improved reliability, reduced weight, higher achievable signalbandwidths, increased immunity to EMI, increased data security, etc
Technology keywords
Not reported