APPLICATION OF HIGH TEMPERATURE SUPERCONDUCTORS TO ELECTRONIC CIRCUITRY

SEI'S PROJECT OBJECTIVE IS TO DETERMINE EFFECTIVE USES OF HIGH-TEMPERATURE SUPERCONDUCTORS IN ELECTRONIC CIRCUITRY FOR IMPROVING OVERALL PROPERTIES OF SIGNAL DISPERSION, FREQUENCY RESPONSE, PACKING DENSITY, REDUCED CROSSTALK, AND REDUCED POWER DISSIPATION. SEI PERSONNEL WILL SELECT A REPRESENTATIVE ELECTRONICS ASSEMBLY SUITABLE FOR INCORPORATION OF SUPERCONDUCTING LEADS AND TRANSMISSION LINES, PRIORITIZE THE TYPES OF SUPERCONDUCTING INSERTIONS, AND EVALUATE THE COST BENEFITS OF EACH. SEI WILL ALSO INVESTIGATE INCORPORATION OF MODELS FOR SUPERCONDUCTING LEADS AND TRANSMISSION LINES INTO A CAD PROGRAM, WITH THE OBJECTIVE OF INCREASING THE ABILITY TO EVALUATE THE EFFECTIVENESS OF SUPERCONDUCTOR INSERTIONS INTO AN ELECTRONIC ASSEMBLY. WE WILL DETERMINE WHAT MODIFICATIONS ARE REQUIRED TO THE CAD PROGRAM TO ENABLE IT TO OPTIMIZE THE CIRCUIT LAYOUT GEOMETRY ACCORDING THE THE SPECIAL PROPERTIES AND PROCESSING REQUIREMENTS OF SUPERCONDUCTORS. ANTICIPATED BENEFITS INCLUDE DEVELOPMENT OF THE TECHNOLOGY TO MODIFY A CAD PROGRAM TO OPTIMIZE THE CIRCUIT GEOMETRY OF HIGH-TEMPERATURE SUPERCONDUCTORS. CIRCUIT IMPROVEMENT INCLUDES REDUCING SIGNAL DISPERSION, BROADENING FREQUENCY RESPONSE, INCREASING PACKING DENSITY, REDUCING SIGNAL CROSSTALK, AND REDUCING POWER DISSIPATION. COMMERCIAL APPLICATIONS INCLUDE SALE OF THE MODIFIED CAD SOFTWARE PACKAGE DESCRIBED.