Additive manufacturing of robust, nonplanar electrical interconnects

Optomecrsquo;s proposed innovation is a direct-write additive manufacturing process, creating 25um electrical interconnects that can accommodate 3D steps and are terminated in a wire bond pad.nbsp; These printed interconnects will minimize packaging space by replacing traditional wire bonds with conformal fan-out electrodes.nbsp; This additive manufacturing proposal ldquo;is a science enabling technology for the next strategic class of astrophysics missions,rdquo; as stated in scope description of solicitation S12.06. Improving the packaging for large format multishutter arrays is a goal relevant to several NASA missions, including the Large UV/Optical/IR Surveyor (LUVOIR) and the Habitable Exoplanet Observatory (HabEx) missions. Optomecrsquo;s innovation uses metal nanoparticle dispersions or ldquo;inksrdquo; to create pad and trace patterns, and these patterns are functionalized by sintering the metal nanoparticles at low temperatures or with a laser to make electrically conductive conformal interconnects. The Aerosol Jetreg; technology creates a high velocity stream of tightly collimated droplets, which means that liquid inks can easily be jetted in precise patterns.nbsp; Tilting the jetting head relative to the flat substrate gives direct vision of both horizontal surfaces and vertical sidewalls, enabling interconnect printing over steps up to 1.5mm high and beyond.nbsp; The tight collimation of the Aerosol Jet stream also means that Optomec can create very fine features, 25um size and smaller.nbsp; Thenbsp;Phase II effort will focusnbsp;on prototyping Microshutter Array (MSA) interconnects packages and testing these packages for reliability in harsh conditions.nbsp; The project willnbsp;further optimizenbsp;the printable materials and sintering processes to facilitate robust thermo-mechanical and electrical interconnections.nbsp;