SBIR/STTR Research Award

SBIR Phase I: Refrigerant-free heat pump using high-performance thermoelectric materials and methods

Award identifier b341534125a0f225b5d799542de4f4cf6d57747861443324e1c00bfb24ea3791Awarding agency National Science Foundation

Award amount

$275,000

Program and phase

SBIR · Phase I

Award year

2024

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
MIMIC SYSTEMS INC
Proposal award date
2024-07-15
Contract end date
2025-03-31
UEI
N3KLCQK3PKP1
Solicitation number
NSF 23-515
Topic code
ET

Research abstract

The broader impact of this Small Business Innovation Research (SBIR) Phase I project is through the development of a more efficient and cost-competitive solid-state heat pump technology for heating and cooling. Buildings are one of the largest contributors to carbon emissions, substantially associated with heating, cooling, and domestic hot water production. As an all- electric technology, solid-state heat pumps can easily be powered directly by renewable power, such as solar or wind. This would not only reduce reliance on fossil fuels but will also contribute to the sustainable electrification of the built environment that is necessary to mitigate the effects of climate change. This refrigerant-free technology may also avoid refrigerant leaks that contribute to climate change. As a retrofit, it would enable multifamily residential buildings to comply with the emerging more stringent carbon emission standards. In New York City alone, this represents a potential $2.2 B market. This project aims to increase the efficiency and cost-effectiveness of traditional solid-state heat pumps based on thermoelectric energy conversion by leveraging new thermoelectric materials and modern manufacturing processes to surpass the performance of traditional vapor-compression heat pumps. The approach aims to integrate the active components of thermoelectric heat pumps, specifically the thermoelectric legs and electrodes, directly and in intimate thermal contact with active heat exchanger surfaces leveraging ink-based thermoelectric systems with high figure of merit. The proposed configuration and manufacturing process minimizes the deleterious interface and heat pump substrate thermal resistances, increasing the system performance. A multi-disciplinary team will integrate scalable fabrication processes for thermoelectric materials using sintering with printable electronics on metal core substrates. The goal of this project is to determine the feasibility of the approach by building and testing a representative assembly that can be easily scaled up to provide larger heating and cooling capacities. This approach constitutes a radical redesign to how thermoelectric systems are assembled, unlocking new opportunities toward delivering sustainable and scalable solutions for heating and cooling. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

2 SBIR/STTR records share this UEI (2024–2026). Reported award amounts total $1,525,000. Reported amounts are not federal obligations.

Phases: Phase II, Phase I

Agencies: National Science Foundation

Agency intelligence

National Science Foundation

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