Improved NDI Functionality Through 3dIV Software Enhancements

Reverse engineering of Printed Circuit Boards and Circuit Card Assemblies requires methods and software to accurately process and analyze computed tomography (CT) volumes of electronic objects. Current technical challenges include but are not limited to stitching together multiple overlapping CT volumes, correcting for warpage in electronics CT volumes, imaging individual electronic circuit layers whose inter-layer spacing is near the CT voxel resolution/size, reducing/correcting for CT beam-hardening effects, and interfacing various CT software tools with varying capabilities. This project will enhance the 3dIV SBIR software previously developed in the areas of: 1) isolated environment deployment (e.g., containerized application), 2) exporting voxel volumes in formats suitable for use by other applications, 3) enhanced de-warping (including whole volume de-warping) and circuit layer imaging features, 4) stitching together and blending multiple voxel volumes which contain some overlapping areas, and 5) gathering feedback from end-users on UI/UX design/usability and feature improvements and performing custom development based on this feedback.