Fiber-to-chip fusion splicing for low-loss photonic packaging with space applications
Award amount
$149,987Program and phase
STTR · Phase IAward year
2023Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- PHOTONECT INTERCONNECT SOLUTIONS INC
- Proposal award date
- 2023-07-31
- Contract end date
- 2024-09-02
- UEI
- HJ5BVBLSAKM8
- Solicitation number
- STTR_23_P1
- Topic code
- T8
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Novel mode converter and fusion splicing for low coupling loss for high power, near infrared applications
- SBIR Phase II: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing
- SBIR Phase I: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing
Research funding history
4 SBIR/STTR records share this UEI (2023–2025). Reported award amounts total $1,814,981. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: National Science Foundation, Department of Defense, National Aeronautics and Space Administration