SBIR/STTR Research Award

Fiber-to-chip fusion splicing for low-loss photonic packaging with space applications

Award identifier 98d7fdaee5de6f5ef5413557708fa47c21d6acd415416c6abe1b646dac7a7479Awarding agency National Aeronautics and Space Administration

Award amount

$149,987

Program and phase

STTR · Phase I

Award year

2023

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
PHOTONECT INTERCONNECT SOLUTIONS INC
Proposal award date
2023-07-31
Contract end date
2024-09-02
UEI
HJ5BVBLSAKM8
Solicitation number
STTR_23_P1
Topic code
T8

Research abstract

Photonectrsquo;s novel technology described in this proposal permanently attaches an optical fiber to a silicon chip using fusion splicing with methods and components that are scalable to high volume manufacturing, tolerant to mechanical and thermal stress, and limit loss. NASA has conveyed their need for coupling approaches and components resulting in low misalignment tolerances, which is directly addressed by Photonectrsquo;s technology. Currently, NASA views high efficiency coupling as losses less than 6 dB per attachment, which Photonect has drastically reduced with their technology. Photonect has gathered preliminary data showing their ability to easily fuse optical fibers to chips with extremely low losses around 1 dB in room temperature environments. However, to explicitly amend Photonectrsquo;s technology for space applications, coupling losses across a wide range of temperatures must be determined, as well as reliability of the fused spot in space impacted by thermal expansion. Photonect is confident that regardless of the temperature, their technology will result in losses much less than NASArsquo;s requested 6 dB. Successful results from this Phase I application will get NASA one step closer to having increased accessibility to PIC technologies, as Photonectrsquo;s technology will allow for easy, reliable photonic packaging. Since Photonectrsquo;s solution is specifically for packaging photonic devices, there is a massive range of applicability for the types of technologies that this solution will benefit. Photonectrsquo;s solution can be used to package any PICs that contribute to reduced SWaP of scientific instruments and subsystems or any PICs that increase the robustness of equipment involved in launch, space travel, and entry and landing. Enabling faster, less expensive, and easier photonic packaging makes PICs utilizing large numbers of optical fibers more feasible, granting access to new technologies that facilitate new scientific discoveries.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

4 SBIR/STTR records share this UEI (2023–2025). Reported award amounts total $1,814,981. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: National Science Foundation, Department of Defense, National Aeronautics and Space Administration

Agency intelligence

National Aeronautics and Space Administration

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