Wafer Scale Hybridization of Dissimilar Materials for Large Arrays

A dense level of interconnects is necessary for the next generation of systems to have larger format infrared imaging arrays.á Currently, Through Silicon Via (TSV) technology is being utilized to stack together multiple silicon wafers, such as combining a processing chip with an imaging chip. áTSV enables a more integrated system that is more powerful than the two chips sitting next to each other or connected through a ball grid array.á However, TSV has proven to be very difficult to implement with dissimilar materials especially infrared imagers because of the fragile substrates.á The processing yield is low because these non-silicon materials are notáperfectly flat.á To address these issues áPrinceton Infrared Technologies, Inc. will utilize carrier wafers to allow chemical mechanical polishing of thick oxide layers to create a flat surface.á The carrier wafers will prevent breakage of the fragile infrared material.á Wafer scale hybridization will enable large format arrays to be built with higher yield and lower cost.á