Large Footprint Silicon Leadless Chip Carrier

RobustĀelectronic packaging is criticalĀtoĀthe performance of inertial sensors in austere environmentsĀandĀto mitigate damage from mechanical, thermal, and radiation effects.ĀMechanicalĀdamage originates fromĀlarge shocks and vibrations and significantĀharmonic loading.ĀThermal damage and thermal errors originate from poor temperature control and induced thermal stresses. Precision microfabricatedĀsensorsĀcan suffer significant errorsĀdueĀtoĀtemperature andĀinducedĀstrains.ĀFinally,Āionizing radiation exposure and/or high-power RF countermeasuresĀdisruptĀcritical integratedĀcircuits by inducing charges or changing the physical properties of the semiconductor material itself. The integrated circuits are critical for signal conditioningĀandĀerror compensation. Meeting the environmental needs for precisionĀsensorsĀwith low-SWaP-C requires considerable design and integration of the sensors, integrated electronics, and package.ĀĀ This proposalĀwill developĀintegratedĀradiation spot shielding and thermal isolationĀforĀadditively manufacturedĀpackages. TheĀconceptĀincludes a ceramic packageĀwith integrated vias and conductors. The package includesĀaĀlarge internal volumeĀto houseĀmechanical protection, thermal protection,Āmounted sensors,Āand electronics.ĀThe package will include a large internal footprint toĀpackage multi-chip modules andĀchip-bonded stacks.ĀThe proposed work will developĀ1)Āmaterials and processes required toĀadditively manufacture radiation shieldingĀmaterials. 2) materials and processes to mitigate thermal stresses due to die attachment to the package, and 3) manufacturing methods for these newĀmaterial systems with our existing ceramic printed packages.