Thermal Management of V-band Transmit Arrays with Oscillating Heat Pipes

Under this proposed Phase I SBIR effort, ThermAvant Technologies (ThermAvant) shall design, model, prototype and analyze the thermal performance of oscillating heat pipe (OHP) thermal heat sinks to acquire, rapidly spread and isothermally manage the heat produced during operation of the V-band phased array. The OHP design will expand the operating window of the V-band array without size, weight and power (SWaP) penalties imposed by status quo heat sinks. ThermAvant will work with a partner to develop V-band phased array architecture designs that enable the integration of the architecture with ThermAvant’s OHP technology. Lastly, ThermAvant will investigate different heat sink materials and designs to optimize the OHP heat sinks for future, higher-volume supply to military and commercial customers.