Nano Display Fabrication Using Wafer to Wafer Bonding

Tectus Corporation (dba Mojo Vision) has built the world’s first Augmented Reality (AR) Contact Lens (CL) with the world’s smallest and highest density display embedded. First customers are likely in US Government and low-vision categories, followed by consumers. The worldwide market consists of more than one billion (1B) people, making this a $1T market over time. The company has raised over $150M in private financing from sophisticated investors, has multiple government contracts and has an experienced executive team.    Tectus is under SBIR Phase II contract with AFWERX to adapt our AR CL for first use (basic ATAK integration) by USAF, and that project is on track. Tectus was also awarded a Strategic SBIR Phase IIB to develop deeper ATAK integration, conduct on eye trials and achieve FDA approval for field trials, operational use and to transition into a program of record. This X20.R Direct to Phase II proposal, which is NOT part of any USAF or other US Government contract, will ensure the ability to build displays at scale for the highest performance and lowest cost as our AR CL is transitioned into a program of record by PEO ISR/SOF.   To support the anticipated commercial and government volumes required for Tectus AR CL, Tectus must also design, engineer and build the world’s smallest and highest density display in high volume.  To date, we have built these highly custom, world record pixel density displays by hand in our labs using a one-at-a-time Die-to-Die (D2D) bonding technique.  In order to scale our solution as well as facilitate even higher pixel density and eventually color displays, we must advance innovation in manufacturing of our Nano-displays by developing a Wafer-to-Wafer (W2W) bonding capability.   This project helps Tectus advance innovation in manufacturing using a W2W bonding technique adapted from silicon CMOS industry.  Silicon CMOS industry bonds two CMOS wafers together using W2W bonding to create commercial products such as 3D high density memory.  This project proposes to adapt this technique to create high quality, high resolution Nano-Displays based on W2W bonding of a Silicon CMOS wafer to a Gallium Nitride LED wafer.  The resulting displays are enabling components for systems, such including Tectus AR CL, and advancing innovation in manufacturing with a US-based supply chain to ensure that the US retains capability in this important new category of devices that will worn by USAF and others in DoD, IC and DHS to gain strategic capabilities and accomplish tactical missions.