Hybrid Integration of Photonics and Cryogenic Electronics with Magnetic Shielding

The "Hybrid Integration of Photonics and Cryogenic Electronics with Magnetic Shielding (HIPCEMS)” effort will develop a scalable heterogeneous packaging plan which results in extreme energy efficiency information transfer at high clock rates and low bit error rate of digital data between superconducting and photonic technologies, each at 4K. HIPCEMS will feature a mechanically robust package that withstands repeated thermal cycling from 300K without performance degradation. Our team will equally address the needs of magnetic shielding and low loss optical fiber attachment and alignment in a Multi-Chip Module (MCM) context. Our proposed concept leverages multilayer integrated magnetic shielding with on-chip fiber optic couplers. The initial design will integrate a photonic waveguide in a loop configuration to allow two-port characterization of the coupling loss.