Direct Write Printing of Graphene-Based Composite EMI Shielding for RF Device Protection

This Small Business Innovation Research Phase I project addresses the problem of developing a graphene-based composite EMI shielding material capable of replacing metal shielding in IC packages and printed circuit board components. The rationale for this Phase I project is that the graphene ink is capable of being deposited at ambient conditions using direct write additive printing processes on Mylar substrate with an electrical conductivity > 100,000 S/m, at annealing temperature 50 dB across 8-18 GHz. The Phase I objective is to demonstrate the development of single-layered and multi-layered graphene-based composite EMI shielding for RF device protection. The Phase I Option objective is to demonstrate the implementation of the validated single-layered graphene-based composite EMI shielding on different electronic substrates and packaging. The major technical hurdle is to formulate a graphene based composite ink that is environmentally stable with electrical conductivity exceeding metals and deposit a uniform, stable and highly conductive graphene layer using direct write inkjet and aerosol printing processes, at ambient conditions. At the conclusion of this Phase I SBIR, it is expected that a graphene-based composite EMI shielding which meets the success criteria of the objectives of the proposed project will be available for scale-up demonstration in Phase II.