Integrated Micromachined Probing Platform for In-Situ Vacuum Characterization of Devices and Components at Millimeter and Submillimeter Wavelengths

The objective of this effort is to investigate, prototype, and bring to market a robust measurement technology and platform that permits direct, in-situ measurement of devices and components enclosed within vacuum chambers as well as other shielded or controlled environments. The aim is to develop solutions capable of broad frequency operation, extending from the millimeter-wave range (50 GHz) to frequencies approaching 1 THz. The work consists of five tasks that address the primary challenges in implementing a practical vacuum-compatible measurement platform that incorporates state-of-the-art sensor and source technologies. These tasks include development, design, and demonstration of (1) micromachined probes to interface DUTs to the measurement instrumentation (2) integrated, low-profile Schottky diode sensors, frequency multiplier sources, and broadband photodiode-based generators, to implement measurement instrumentation and components, (3) six-port network analyzer architectures that permit direct integration of sensors into the probe head interface, (4) in-situ calibration standards and methods suitable for hermetically-sealed environments, and (5) a full measurement platform protoype with probe, integrated millimeter/submillimeter-wave measurement instrumentation, and vacuum-compatible feedthroughs. The outcome of this effort will be a low-profile, cost-effective measurement platform for millimeter and submillimeter-wave characterization that overcomes the inherent limitations of existing infrastructure based on waveguide and hybrid assembly.