3D PRINTABLE, REACTIVELY DEPOSITED HYBRIDSIL MATERIALS FOR THE FFF PRODUCTION OF HIGH TEMPERATURE TOOLING

The primary goal of NanoSonic’s Army SBIR program is to provide the U.S. Army Communication-Electronics Research Development & Engineering Center (CERDEC) with a next-generation high temperature copolymer technology that may be directly integrated into unmodified COTS FFF desktop 3D printers to produce durable high-pressure injection molding tooling used to produce over-molded cable ends meeting MIL-M-24041 at the Tobyhanna Army Depot. To achieve this goal, NanoSonic established a novel high temperature reactively extruded thermoset monofilament that has the necessary properties for technical and commercial success through a Phase II advancement. Of critical importance underscoring the promise of this technology, NanoSonic has successfully demonstrated 3D printed samples reactively crosslinking to form thermosets that have the necessary compressive resilience at 90 C and 2,000 psi necessary for high-pressure injection molding operations. NanoSonic achieved its Phase I objectives and demonstrated that it has the capability of producing a next-generation HybridSil feedstock technology that may be readily integrated within COTS 3D printers and used to additively manufacture tooling used to produce over-molded cable ends.