SBIR/STTR Research Award

Monolithic Tungsten Plasma Facing Components

Award identifier 2c0205c9745102d9097f5106437f815a4f691149215d24c81ffb0f6ec7d1dce3Awarding agency Department of Energy

Award amount

$199,990

Program and phase

SBIR · Phase I

Award year

2019

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
POLARONYX INC
Proposal award date
2019-07-01
Contract end date
2020-03-31
UEI
R1Y4LG8WRBF8
Solicitation number
DE-FOA-0001941
Topic code
23a

Research abstract

Additive manufacturing (AM), esp. laser AM, becomes a powerful tool to replace conventional methods such as casting and hot spray, due to its cost effectiveness and capability of making complex structure and composition. However, there are several limitations for current laser AM processes to be used for 3D manufacturing of Tungsten based PFCs such as divertor to battle with challenges such as radiation tolerance, residual stresses, lamination, density, uniformity, and variation in mechanical strengths. Based on our patented laser AM technology and the world’s first demonstration of fs fiber laser AM system (2016 R&D Award), PolarOnyx proposes, for the first time, a fs fiber laser based AM process with LIBS/NDI feedback to overcome these difficulties and meet the requirement of making Tungsten PFCs just in one process without any welding process. Compared with CW laser AM, the proposed fs laser AM system creates instantaneous high temperature to melt high temperature and high thermal conductivity metals (e.g. Tungsten) and form much stronger micro-scale welding/bonding between similar or dissimilar refractory metal powders to form various shapes and sizes. This multi-functional capability (SM and AM, controllable melting temperature and HAZ) is not achievable for CW laser AM and will significantly reduce the building time and cost.In addition to the metal 3D AM applications, material processing is another major commercial application for this project. This includes (1) Photonic device fabrications, such as waveguide, coupler, WDM, modulator, and switching; (2) all types of metal processing such as welding, cutting, annealing, and drilling; (3) semiconductor and microelectronics manufacturing such as lithography, inspection, control, defect analysis and repair, and via drilling; (4) marking of all materials including plastic, metals, and silicon; (5) other materials processing such as rapid prototyping, desk top manufacturing, micromachining, photofinishing, embossed holograms, and grating manufacturing.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

111 SBIR/STTR records share this UEI (2002–2025). Reported award amounts total $37,075,053. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Health and Human Services, National Science Foundation, Department of Commerce

Agency intelligence

Department of Energy

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