A Novel Cost-effective Low temperature copper inks for flexible hybrid electronics and conformal antennas

Advantageously, nanoparticle-based inks have lower curing temperatures than those typical for bulk curing. A low-temperature and air-stable copper solution enables high performance and lower-cost metallization when deposited on substrates including fabric, cellulose, and plastics. In Phase-I, Texas Biochemicals fulfilled concept goals by developing novel, environmentally-benign and cost-effective copper nano-inks. Results show consistent deposition of copper nano-inks in ambient conditions on two substrates: 1. Polyimide (Kapton) and 2. PET. The screen-printed copper nano-ink line widths 200 μm, 150 μm, 100 μm, 70 μm, 50 μm and 40 μm prove continuous and conductive lines. The post-deposition copper nano-inks heat treated below 120C (compatible with both substrates) while retaining 2.3x107(S/m) high conductivity values. The film morphology illustrates that the copper nano-inks produced via microwave-assisted reactions are dense, spherical copper nano-particles. Phase II will incorporate the copper solution/ink and low-cost manufacturing process into an in-line assembly process, emphasizing roll-to-roll printing. Future processing protocols with low-cost and scalable deposition methods congruent with the electronics manufacturing service (EMS) industry will be enacted. Texas Biochemicals will integrate a package relevant to the Air Force customer featuring small-scale production processes. Collaboration with a leading manufacturer has been established to evaluate samples, provide technical guidance, and support Phase III.