Power Electronics Thermal Interfaces (PETI)

Thermal interface materials (TIM) for die attachment and thermal interconnections are crucial for the stable and reliable operations high-temperature, high-power-density power electronics based on wide-band-gap (WBG) semiconductor devices. In this SBIR project, Aegis Technology proposes to develop a novel class of hybrid Ag-based TIM pastes, namely high temperature solder, which can be synthesized with a cost-effective and scalable process, and which is expected to possess enhanced thermal and mechanical performance in the resultant joints when compared to those of currently available TIM products. In addition, these hybrid Ag-based TIM pastes can be directly applied to the current power electric packaging production lines, and especially these pastes can be bonded with bare Cu surfaces without the application of external pressures and inert protective gases, leading to a much simplified, low-cost bonding process. Phase I will focus on the feasibility demonstration of the proposed technology, which will set up a solid foundation for the subsequent Phase II, in which further optimization and scaling up will be carried out to enable potential pilot-scale or mass fabrication, and a power module unit using the developed pastes and the associated bonding/sintering process will be prototyped and evaluated.