Next Gen Infrared Emitter Array Packaging

Hardware-In-the-Loop (HWIL) system users are anticipating major Infrared (IR) scene quality improvements through a new generation of emitter arrays. The arrays feature increased spatial resolution, rapid frame rates and much broader radiant dynamic range. These enhancements represent a sea change in Infrared Scene Projector (IRSP) performance that will set the standard for years. This new capability comes with new challenges. The arrays experience increased yield sensitivity, require greater power and more electrical interfaces. In the case of Infrared Light Emitting Diodes (IRLEDs), cryogenic cooling is needed. Cryo cooling has never been available on a Flight Motion Simulator (FMS). Yield concerns with extremely large monolithic chips have also led to precision-aligned multi-chip architectures.Oleson Convergent Solutions LLC (OCS) has developed new architectures for packaging and housing advanced FMS based emitter arrays. In Phase I major strides were made in addressing projection requirements by leveraging both new and recently developed technologies. We extended cryogenic cooling to FMS-based systems where mobility, compact architecture and hundreds of thermal cycles are required. We addressed the electrical and power needs of advanced arrays. In Phase II, we will implement the new ideas into practice by designing, building and testing an FMS-ready housing for advanced emitter arrays.