SENSOR CHIP ASSEMBLY (SCA) FOR THE WFIRST PROJECT
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80GSFC18C0095
- Contractor
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $23,035,123
- Period of performance
- Jun 14, 2018 – Dec 13, 2020
- NAICS
- 334413 — Semiconductor and Related Device Manufacturing
- PSC
- PSC 6650
Public award description
SENSOR CHIP ASSEMBLY (SCA) FOR THE WFIRST PROJECT
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