WAFER GRINDER AND CHEMICAL MECHANICAL POLISHER (CMP) TOOL
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- N0017325P2417
- Contractor
- Awarding agency
- Department of Defense
- Sub-agency / office
- Department of the Navy
- Award amount
- $569,080
- Period of performance
- Mar 25, 2025 – Sep 6, 2025
- NAICS
- 333242 — Semiconductor Machinery Manufacturing
- PSC
- PSC 3670
- Place of performance
- AZ
Public award description
WAFER GRINDER AND CHEMICAL MECHANICAL POLISHER (CMP) TOOL
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