SILICON WAFERS 3 INCH, THICKNESS 325 TO 410 MICRONS, <100>, PRIME GRADE, STANDARD FLATS, P-TYPE BORON DOPED…

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: NNC10MA29P
Contractor
Awarding agency: National Aeronautics and Space Administration
Sub-agency / office: National Aeronautics and Space Administration
Award amount: $0
Period of performance: Mar 11, 2010 – Apr 9, 2010
NAICS: 334413 — Semiconductor and Related Device Manufacturing
PSC: PSC 9390
Place of performance: CA

Public award description

SILICON WAFERS 3 INCH, THICKNESS 325 TO 410 MICRONS, <100>, PRIME GRADE, STANDARD FLATS, P-TYPE BORON DOPED 1-10 OHM-CM, SINGLE SIDE POLISHED, SCRIBED ON FRONT SURFACE ALONG PRIMARY FLAT, EACH WAFER SCRIBED WITH UNIQUE IDENTIFIER FROM GRC-500 TO GRC-999

Source: USAspending.gov

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