SIC WAFERS - 4H SIC, N-TYPE PRODUCTION GRADE, 3 IN.DIA X 4 IN.OFF-AXIS, .015-.028 OHM-CM MICROPIPE DINSITY,…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- NNC12ME32P
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $0
- Period of performance
- Sep 12, 2012 – Oct 31, 2012
- NAICS
- 334413 — Semiconductor and Related Device Manufacturing
- PSC
- PSC 9390
- Place of performance
- NC
Public award description
SIC WAFERS - 4H SIC, N-TYPE PRODUCTION GRADE, 3 IN.DIA X 4 IN.OFF-AXIS, .015-.028 OHM-CM MICROPIPE DINSITY, BOTH SIDES POLISHED/ SILICON FACE CMP
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