FPGA MECHANICAL COMPONENTS PACKAGE AND DAISY CHAIN
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- NNG16LP91P
- Contractor
- MICROSEMI SOC CORP.
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $12,040
- Period of performance
- Jun 12, 2018 – Jan 29, 2016
- NAICS
- 334413 — Semiconductor and Related Device Manufacturing
Public award description
FPGA MECHANICAL COMPONENTS PACKAGE AND DAISY CHAIN
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- Agency: National Aeronautics and Space Administration
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