In-situ Fiducial Marker

To address the DMEA's need for a through-lens fiducial marker technology in semiconductor device inspection, Hedgefog Research Inc. (HFR) proposes to develop a new In-situ Fiducial Marker (IFM), based on laser-activated, electrostatically assisted marking at designated spots. Novel system features in IFM will enable non-destructive fiducial marking (diameter < 5 micron) in real time while operating IR microscope/scanner in the backside review configuration. The controlled marking process of IFM causes minimal negative impact on the substrate and offers clear visibility both in IR microscope and FIB, thereby providing enhanced traceability in Failure Analysis (FA) and Fault Isolation (FI) applications. In Phase I, HFR will demonstrate the feasibility of IFM by performing a proof-of-principle demonstration of its key technical aspects with a breadboard prototype, to characterize IFM performance and reach TRL-4. In Phase II, HFR will integrate the Phase II IFM prototype with an existing IR microscope/scanner platform, which will be tested with semiconductor device samples approved by DMEA personnel, to reach TRL-6.