SBIR/STTR Research Award

FLASHRAD:A Non-Volatile 3D Rad Hard Memory Module for High Performance Space Computers

Award identifier 97b5fe982ac30860bc9a5cf6b3c8fa98239543a0d34a8c2abe523285b06dce7dAwarding agency National Aeronautics and Space Administration

Award amount

$746,397

Program and phase

SBIR · Phase II

Award year

2018

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
Irvine Sensors Corporation
Proposal award date
2018-06-13
Contract end date
2020-03-12
UEI
QS98AJNH3J28
Solicitation number
SBIR_17_P2
Topic code
Z6

Research abstract

The computing capabilities of onboard spacecraft are a major limiting factor for accomplishing many classes of future missions. Although technology development efforts are underway that will provide improvements to spacecraft CPUs, they do not address the limitations of current onboard memory systems. In addition to CPU upgrades, effective execution of data-intensive operations such as terrain relative navigation, hazard detection and avoidance, autonomous planning and scheduling, and onboard science data processing and analysis require high-bandwidth, high-capacity memory systems to maximize data storage and provide rapid access to observational data captured by high-data-rate instruments (e.g., Hyperspectral Infrared Imager, Interferometric Synthetic Aperture Radar).Three-dimensional ICs, after a long wait, are now a reality. The first mainstream products are 3D memory cubes that offer manifold improvements in size, capacity, speed, and power. Unfortunately, none of these are ready for space. The purpose of this research and development is to pursue a non-volatile, 3D memory module that can meet the high-reliability requirements of space and interface to the High Performance Space Computer (HPSC) using a high-speed serial interface. Development will include fabricating a 3D memory cube and RTL for a FPGA based memory controller which will eventually be migrated to a rad-hard ASIC. The FPGA based platform will integrate a 3D memory cube to produce a 3D memory module prototype that will validate and demonstrate the features, reliability, and performance of the envisioned 3D module.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

186 SBIR/STTR records share this UEI (1983–2021). Reported award amounts total $64,762,800. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Health and Human Services, National Science Foundation, Department of Homeland Security

Agency intelligence

National Aeronautics and Space Administration

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