SBIR/STTR Research Award

RADIATION HARD HIGH SPEED CAMERA SYSTEM FOR ACCELERATOR BEAM DIAGNOSTICS

Award identifier ded9312b1164b21c3b25b630d9e676a98dfb9f4765f3d8fa2664e1e23a0b281cAwarding agency Department of Energy

Award amount

$1,009,445

Program and phase

SBIR · Phase II

Award year

2018

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
Alphacore, Inc.
Proposal award date
2018-05-21
Contract end date
2020-05-20
UEI
CXMPDDLFBCH3
Solicitation number
DE-FOA-0001794
Topic code
24h

Research abstract

Alphacore intends to submit a proposal for a Sequential Phase IIA grant in January 2018. Thus far in Phase II Alphacore has developed an initial prototype of a radiation-hardened 10,000-pixel camera with custom- designed 10,000-frames-per-second (10kpfs) capable image sensor IC, camera control PCB with FPGA and interface to a PC, and an enclosure allowing different lens options. Most of Alphacore's engineering hours have focused on the design of an optimized, 1-megapixel, 10kfps, radiation-hardened CMOS image sensor. This image sensor, in addition to being radiation hard, is the fastest megapixel-class image sensor with continuous video output ever built, to the best of our knowledge. Thus, it has tremendous potential value for scientific, medical, military and entertainment industries. One of the parameters that speaks to the complexity of this chip is the fact that it has four thousand 12-bit, 3MSPS ADCs. These relatively high-speed SAR ADCs have very specific pitch-matched layouts, i.e. they are 10um wide and 3mm long. Alphacore’s sensor has ultra-sensitive, radiation-hardened pinned photodiode pixels. At this point, the SPICE model for the full chip architecture is functional and transistor-level designs have been completed for all the circuit blocks. First version of the physical layout design has been completed for the full image sensor. The extracted netlist from the layout is not fully functional for the first layout version as of today and we are debugging it. We believe that the tapeout of this full-reticle-sized (22mm x 27mm) image sensor will take place in January 2018 and this means that it can be tested in April - May 2018.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

155 SBIR/STTR records share this UEI (2013–2026). Reported award amounts total $63,784,604. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Commerce

Agency intelligence

Department of Energy

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