Materials and Manufacturing Reliability for Extreme Environment Structural and Additive Electronics

Integrating electronics onto structural 3D objects for extreme environments poses many challenges, but doing so is necessary to meet requirements for NASA missions to Venus, solar probes, and propulsion applications. Contour Circuits, together with STTR partner Iowa State University, will provide both a material system and a manufacturing process capable of fabricating components for sustained operating temperatures of 500-800°C. Specifically, we will develop platinum nanoparticle inks with inorganic binders for aerosol jet printing (AJP). The selection of platinum is based on its favorable melting temperature, electrical conductivity, redox potential, and coefficient of thermal expansion, which closely matches structural materials such as alumina and titanium. The addition of inorganic binders is an established strategy to improve metal adhesion to ceramic substrates and mitigate CTE mismatch. The use of off-the-shelf platinum inks and binders will accelerate materials development, permitting more time to address the manufacturing challenges posed by AJP to de-risk implementation and scaling. Although well-suited for printing electronics onto 3D objects, industry acceptance of AJP has been slowed by shortcomings with manufacturing reliability and repeatability. The key personnel at Contour Circuits and Iowa State University have developed a real-time deposition rate monitoring system for AJP and demonstrated robust closed-loop process control to maintain stable deposition rate over shift-length prints. Addressing AJP’s core manufacturing challenges will speed development of this platinum-alumina material system and others relevant to NASA applications in extreme environments. At Contour Circuits, we will provide fabrication services for 3D structurally integrated electronics efficiently serving NASA and other stakeholders at varying TRL for materials development, prototyping, and eventually production of additively manufacturing electronics.