Additively Manufactured Electronics for Extreme Environmental Conditions

The main Phase II objectives are to achieve these specifications: 1) Develop the capability to monitor in situ the resistance of interconnects over extreme temperature and vibration; 2) evaluate interconnect resistance changes and durability over a temperature range of -190C to 125C; 3) assess interconnect durability under vibration conditions; 4) measure connector resistance changes and durability over the same temperature range of -190C to 125C; and 5) evaluate connector durability under vibration conditions. Electronic circuits have a lot of complexity and are comprised of diverse materials, each with different properties. Key mechanical properties, such as tensile strength, compression, and elasticity, can change across temperature ranges. A significant issue with mismatched materials is the difference in the coefficient of thermal expansion (CTE), which can affect mechanical integrity. These diverse materials also include composite materials, such as silver flake in thermoplastic, which must be accounted for. Interconnects, a critical area in electronics, often involve multiple material sets and are the weak link in circuits.Asignificant portion of failures in circuits occurdue to large temperature changes. Interconnects are the most common point of failure, often due to material mismatch, surface contamination, temperature fluctuations, shock, vibration, corrosion, and aging. In Phase I, we conducted preliminary studies on interconnects in BGA and QFN packages. Connectors pose an additional challenge, as they unite two different fabrication techniques into a single package. While AMEs flexibility in shape, process, and materials is advantageous and has shown promise, important tests and studies are required to fully understand its capabilities. These findings will lay the foundation for future AME builds within proper guidelines for fabricating device and ensuring operational confidence.