Integrated Circuit (IC) Die Extraction and Reassembly

Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) has demonstrated significant value by economically resolvingboth commercial high-reliability integrated (IC) requirements as well as solutions to otherwise obsolete IC components.Significant resources have already been allocated to qualifying this technology in both commercial and military markets.However, GCIs most recent DER technology includes gold ball removal, followed by aluminum bond pad re-conditioning with Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG) Over Pad Metallization (OPM) plating, which has attracted attention due to increased reliability through the elimination of compound bonding (bond on original bond remnant).Initial Phase I studies of the ENEPIG DER process have shown that the technology can eliminate compound bonding while delivering a robust solution relative to bond pull and shear requirements following non-biased +250C baking and biased dynamic +125C exposure.The follow-on Phase II work is targeted at qualifying the process for both a consistent manufacturing capability (increased assembly yields, IC performance stability, and long-term reliability)as well as producing product capable of passing the stringent MIL-STD 883 requirements.In the process of completing these tasks, GCI also aims to qualify and resolve at least two IC military obsolescence issues for volume production.