In-Plane Conductivity Improvement to Fiber Reinforced Composite Materials

Missile modernization and future missile designs are utilizing more sophisticated and higher powered electronics in the pursuit of extended missile range, improved accuracy, and precision targeting for striking enemy threats.Tight packaging and sophistication of these electronic systems can generate significant heat loads, which needs to be dissipated efficiently in order to maintain functionality and survivability. While fiber reinforced polymer (FRP) composite structures are ideal for light-weighting and providing equal or better mechanical performance than their metallic counterparts. Under previous efforts programs, an approach has been developed for producing lightweight, high performance, thermally conductive composite material system for thermal management of high powered guidance electronics in missile and aviation systems.The approach utilizes low cost, flexible heat spreaders which are directly integrated into a composite structure during fabrication.A follow-up program is proposed here to broaden the technology to offer the potential for integration of other multifunctional improvements, including damage tolerance, thru-thickness conductivity, impact resistance, EMI shielding, and insensitive munitions capabilities. The program will include a comprehensive material characterization, process development and verification/validation of full scale component(s) in order to minimize transition risk and facilitate rapid transition to the field.