In-Plane Conductivity Improvement to Fiber Reinforced Composite Materials (MSC P4188)

Missile modernization and future missile designs are utilizing more sophisticated and higher powered electronics in the pursuit of extended missile range, improved accuracy and precision targeting for striking enemy threats. Tight packaging and sophistication of these electronic systems can generate significant heat loads, which needs to be dissipated efficiently in order to maintain functionality and survivability. This program proposes to develop cost-effective composite airframes and enclosures with integrated, interlaminar heat spreaders that will provide high in-plane conductivity for thermal management without structural degradation. To seek a balance among cost, thermal capabilities, and structural properties, the program will perform trade studies among commercially available heat spreaders (e.g., flexible graphite sheets currently being employed in cell phone and laptop industry). In addition to material evaluation, this program will explore design and processing methodologies to efficiently integrate the heat spreader into composite structures with minimal retrofitting of current fabrication procedures (e.g., filament winding, autoclave, etc.). This research will directly support the Armys need for improved thermal management to protect high value, sensitive guidance and control electronics.