SBIR/STTR Research Award

Large-Format, High-Throughput Photon-Counting Imager

Award identifier f8d2706e6b25828d25d16437676ce8514c93596f535204ba56a7bea92d491869Awarding agency Department of Energy

Award amount

$999,996

Program and phase

SBIR · Phase II

Award year

2017

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
VOXTEL, INC.
Proposal award date
2017-07-31
Contract end date
2019-07-30
UEI
N2KECNUUMBF4
Solicitation number
DE-FOA-0001646
Topic code
07a

Research abstract

Low‐cost, power‐efficient, time‐resolved imaging is increasingly important for Department of Energy remote‐sensing operations. Today’s remote‐sensing operations use photocathode‐based technologies, such as intensified CCDs and CMOS cameras, hybrid image tubes, and hybrid cross‐strip anode image intensifiers. These solutions are expensive, bulky, cannot support high count rates, have low throughput, consume too much power, and have limited area‐coverage and reliability rates. A time‐gated and asynchronous time‐resolved, high‐ throughput, solid‐state, silicon, 1024 x 1024‐element, single‐photon‐counting imaging array, referred to as the time‐ resolved single‐photon avalanche diode (τSPAD) sensor, is being developed. The τSPAD sensor will be sensitive throughout the visible and near‐infrared spectral ranges and will be able to capture a single photon’s spatial location to better than 20 µm and time of arrival to better than 100 ps at GHz count rates. The τSPAD sensor is being developed in a high‐volume, commercial, complementary metal‐oxide‐semiconductor (CMOS) fabrication processes, offering significant cost and scale advantage. Critical specifications for the τSPAD sensor were refined based on DOE requirements and commercial market needs. Top‐level system design, modeling, and trade studies, were performed. A novel, low‐ power, low‐footprint, imager architecture was designed and simulated. All major building blocks of the τSPAD sensor were verified and demonstrated. The τSPAD sensor design will be completed and released for fabrication. Upon fabrication, the chip will be packaged and integrated into Voxtel’s existing brassboard camera platform. Following integration, extensive electrical and optical test and characterization will be performed and sensor performance will be verified against specifications. The τSPAD sensor is generally applicable to three‐dimensional time‐ of‐flight imaging applications. The large format, low noise, and high throughput will directly translate into high area coverage rates, greater ability to operate under high background conditions, higher sensitivity in wide‐area search applications, more‐detailed three‐dimensional imaging without mechanical scanning systems and noiseless motion correction with long effective shutter times. Applications include: lidar, with the ps‐scale resolution of the τSPAD, including automotive navigation, collision avoidance, adaptive cruise control, surveillance, aviation takeoff and landing, unmanned aircraft, and machine vision; and medical imaging, including optical coherence tomography for mammography, neonatal imaging, and improved resolution and throughput in time‐of‐flight positron emission tomography. Furthermore, the innovation benefits the public as it has widespread utility in numerous fields and national security, such as remote sensing for nuclear proliferation detection. Overall, it is an enabling technology for several important scientific, medical, industrial, and consumer applications.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

235 SBIR/STTR records share this UEI (2000–2021). Reported award amounts total $86,180,717. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, Department of Commerce, Department of Homeland Security, Environmental Protection Agency

Agency intelligence

Department of Energy

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