Low-Temperature Packaging Process for MEMS Fuzes

Miniature munitions fuzes comprising microelectromechanical systems (MEMS) sensors packaged with energetic materials are sought for improving fuze reliability, volume, and cost. For some munitions, MEMS fuses may reduce unexploded ordnance rates by an order of magnitude and provide space for extra propellant or explosive to increase range or effect. Creare proposes to develop a wafer-level packaging approach suitable for low-cost, high-volume production of MEMS fuzes. The approach uses conventional MEMS packaging approaches and equipment where possible to minimize development efforts and cost, but it also necessarily includes developing new low-temperature wafer bonding processes that are safe for energetic materials and sensitive MEMS devices. In this Phase I project, we will use our preliminary packaging processes and materials concepts to formulate a wafer-level packaging approach for MEMS devices and energetic materials specified in Navy MEMS fuze concepts. We will model the thermal and strength properties of a baseline package design to show compatibility with energetic materials constraints and package performance requirements and also perform a rudimentary demonstration of a low temperature silicon wafer bonding approach. In a Phase I Option, we will begin developing wafer layouts for future MEMS fuze package prototypes to be developed, fabricated, and tested in Phase II.