Low-Temperature Packaging Process for MEMS Fuzes

Miniature munitions fuzes comprising microelectromechanical systems (MEMS) sensors packaged with energetic materials are sought for improving fuze reliability, volume, and cost. For some munitions, MEMS fuses may reduce unexploded ordnance rates by an order of magnitude and provide space for extra propellant or explosive to increase range or effect. Creare proposes to develop a wafer-level assembly approach suitable for low-cost, high-volume production of MEMS fuzes. The approach uses conventional MEMS packaging approaches and equipment where possible to minimize development efforts and cost, but it also necessarily includes developing a new low-temperature wafer bonding process that is safe for energetic materials and sensitive MEMS devices. In a preceding Phase I project, Creare refined the assembly approach, showed it is compatible with energetic materials constraints and package performance requirements, and performed a rudimentary demonstration of a low temperature wafer bonding approach. In the Base phase of this Phase II project, Creare proposes to develop and optimize the equipment and processes for wafer-level, low-temperature bonds and then demonstrate wafer-level assembly of prototype inert fuze dies. In the subsequent Option phase, Creare proposes to construct and demonstrate a wafer assembly system suitable for medium-scale production of MEMS fuzes.