High-Resolution X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis SoftwareSystem

To address the DMEA need for algorithms and software to accurately analyze data from X-ray microscopy of integrated circuits (ICs), PhysicalOptics Corporation (POC) proposes to develop a new X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis Software (XARA)system for rapid identification and mapping of conductors of ICs. It is based on (a) novel swing nanolaminography image acquisition and acorresponding IC positioning technique; (b) a POC-developed X-ray image deconvolution algorithm for image resolution enhancement; (c) anoptimized, highly effective parallel 2D image stitching algorithm; (d) an optimized highly effective parallel Algebraic Reconstruction Technique(ART) algorithm for fast 3D IC image reconstruction; and (e) an optimized parallel algorithm for segmentation of image layers. In Phase I, POC willdemonstrate the feasibility of XARA, at technology readiness level (TRL)-3/-4 by using basic developed software, simulated and X-raynanoresolution microscopic images. In Phase II, we will build a functional XARA software prototype (TRL-5) capable of performing fully automatichigh-resolution and practical identification and mapping of the conductors of ICs, in accordance with the DMEA performance specifications andrequirements. At the end of Phase II, XARA will be ready to operate on the X-ray microscope specified and made available by DMEA.