SBIR/STTR Research Award
Radiation Hardened Optoelectronics for Optical Interconnects
Award amount
$149,761Program and phase
SBIR · Phase IAward year
2016Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Threat Reduction Agency
- Recipient company
- ULTRA COMMUNICATIONS, INC.
- Proposal award date
- 2016-03-07
- Contract end date
- 2016-10-06
- UEI
- XJWHA6PGHM25
- Solicitation number
- 2015.2
- Topic code
- DTRA152-001
Research abstract
This program develops innovative technology for chip-to-chip and intra-chip interconnects that will operate in extreme radiation environments.There is considerable development in chip-to-chip and intra-chip interconnects in the commercial market.This program will leverage these advancements and demonstrate their applicability to satellite and unmanned avionic vehicles (UAV) platforms.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Built-In Test Capable Aircraft Sensor and Stores Fiber Optic Interface - Star Coupled Net with BIT
- Multi-Wavelength and Built-in Test Capable Local Area Network Node Packaging
- Built in Test (BIT) Capability for Multi-Mode (MM) Fiber Data Networks
- High-Speed Data Transmission in Multimode Fiber
- Robust Optic Signal Distribution within Enclosures for Aerospace Applications
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Low Voltage Radiation Hardened Optoelectronics for Optical Interconnects
- Radiation Hardened Optoelectronics for Optical Interconnects
- Low Voltage Radiation Hardened Optoelectronics for Optical Interconnects
Research funding history
58 SBIR/STTR records share this UEI (2005–2017). Reported award amounts total $22,990,939. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy