Small Pixel Hybridization (< 5 um) for Infrared FPAs

ABSTRACT: Imaging applications such as persistent surveillance and tactical imaging require multi-megapixel imagers to achieve both high resolution and wide fields of view (FOV).Since the pixel size drives the size of the lens and other components in the optical train, the pixel size must be small in order to keep the size and weight of the entire imager manageable for different platforms.We propose to improve the hybridization process through a combination of processing and compression techniques to enable the reduction in ultimate pixel size to less than 5 microns.We will validate our process through the fabrication of high definition infrared imaging arrays with a 5 micron pixel pitch.These FPAs will be fabricated with 2 different detecting materials to demonstrate imaging in the SWIR wavelength range and the MWIR wavelength range.; BENEFIT: The ability to make FPAs with small pixels (5 um) in infrared materials will lead to cost reductions for infrared FPAs because (1) the raw material per die is less and (2) the lens assembly is smaller.The lower costs and smaller size will lead to further deployment of infrared imagers across the services.In addition, commercial applications such as thermography will see lower costs and will therefore expand their market.In terms of performance, the smaller pixel will allow megapixel class imagers to be used in space-constrained applications such as gimbals.The added benefit is that the lens size can be reduced because the focal length of the lens decreases proportionally with pixel size.