Additive Manufacturing Plastic Materials with Improved Dielectric Breakdown Strength

ABSTRACT: Three dimensional (3-D) printing is a robust and facile means for rapidly producing complex geometry prototype electrical insulators. Unfortunately, these techniques are limited towards producing insulators suitable for low voltage applications (e.g. electric field applications < 20 KV/mm ) given current 3-D printed material shortcomings coupled with possible introduction of macroscopic defects into the parts as an artifact from the printing process. Ventana Research Corporation (PI), working in conjunction with noted University of Arizona Electrical Engineering Professor Hao Xin and Raytheon Missile Systems Company, proposes to develop, test and evaluate a series of novel, high performance 3-D printing feedstock resins which are compatible with conventional 3-D printing methods and exhibit high dielectric breakdown strengths; suitable for demanding high voltage microwave power (HPM) applications.; BENEFIT: Upon the successful completion of this Phase I STTR effort, a number of technical and commercial benefits will be advanced and realized. First a whole new series of photocurable resins will be developed which can be readily cured into insulators suitable for demanding high voltage dielectric applications. These resin can not only be processible via conventional 3-D Printing / Rapid Prototyping applications but can also be usable as electrical insulator potting compound use. Such materials will enable the rapid turnaround time fabrication of higher performing HPM insulators.