Next generation HgCdTe FPAs for high frame rate characterization of thermal protective systems
Award amount
$124,996Program and phase
SBIR · Phase IAward year
2015Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- EPIR, INC.
- Proposal award date
- 2015-06-17
- Contract end date
- 2015-12-17
- UEI
- CC7WWF3GJ253
- Solicitation number
- Not reported
- Topic code
- H7.01
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- FEM GeniusóAI-powered Intelligent Agent for Automated Finite-Element Modeling of Aerospace Structures
- Hydrogenation for defect passivation in (Si)GeSn alloys
- Radiation Hardened Infrared FPA
- Radiation Hardened Infrared Focal Plan Array (FPA)
- Multi-Spectral Infrared Focal Plane Arrays
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Flexible, High Char Yield Hybridsil Adhesive Materials for Next Generation Ablative Thermal Protecti
- Adaptive Laser Sintering System for In-Space Printed Electronics
- Software and Tools for Electronics Printing in Space(STEPS)
- Embedded Multifunctional Optical Sensor System
- Heat Shield Recession Measurements Using Remote Spectral Sensors
Research funding history
33 SBIR/STTR records share this UEI (2014–2026). Reported award amounts total $14,424,413. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration