Radiation Hardened Infrared FPA
Award amount
$1,492,044Program and phase
STTR · Phase IIAward year
2025Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- EPIR, INC.
- Proposal award date
- 2025-09-24
- Contract end date
- 2027-09-23
- UEI
- CC7WWF3GJ253
- Solicitation number
- 23.C
- Topic code
- MDA23-P001
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- FEM GeniusóAI-powered Intelligent Agent for Automated Finite-Element Modeling of Aerospace Structures
- Hydrogenation for defect passivation in (Si)GeSn alloys
- Radiation Hardened Infrared Focal Plan Array (FPA)
- Multi-Spectral Infrared Focal Plane Arrays
- Enabling reliable, low temperature direct bonding of silicon via metastable polymorphs and micro-patterning
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Open Topic for Radiation Hardened Microelectronics
- Open Topic for Radiation Hardened Microelectronics
- Low Cost Additive Manufacturing of Radiation Shielding Material & Structures
Research funding history
33 SBIR/STTR records share this UEI (2014–2026). Reported award amounts total $14,424,413. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration