Ruggedized Ceramic Circuit Card Assemblies
Award amount
$999,981Program and phase
SBIR · Phase IIAward year
2015Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- MICRO-PRECISION TECHNOLOGIES, INC.
- Proposal award date
- 2015-06-11
- Contract end date
- 2017-06-10
- UEI
- HF3AKRDE1MN1
- Solicitation number
- 2013.2
- Topic code
- MDA13-005
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- NSN 5961-01-053-3316 Source Approval
- High Operating Temperature Spaceborne Electronics
- GeoFire Real-Time Wildfire Alert System
- NSN 5962-01-217-1430 Source Approval
- 04b Quick-Turn Spaceborne Printed Circuit Boards
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Affordable Engine Flow Path CMC Structures for Hypersonic Vehicles
- All Solid-State Rechargeable Batteries for Throttleable Divert and Attitude Control Systems (TDACS)
Research funding history
14 SBIR/STTR records share this UEI (2015–2025). Reported award amounts total $4,773,324. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Agriculture, National Aeronautics and Space Administration, Department of Energy, National Science Foundation