Conformal Thermal Ground Plane for Fiber Amplifier

ABSTRACT:A key challenge toward future directed energy systems is the development of power and thermal management technologies needed to support the laser systems, particularly fiber lasers. I2C Solutions and the University of Colorado have developed a conformal Thermal Ground Plane (TGP) technology that interfaces hard to cool double clad fibers with laser thermal management systems. During Phase II, TGPs will be developed and qualified specifically for a to-be-selected fiber laser system and the Phase II program will culminate with a demonstration of the functioning laser system with the integrated fiber laser TGP by industry partner.BENEFIT:It is anticipated that the developments undertaken will enable an innovative, extremely efficient thermal transport device that can be integrated with a wide variety of products. Military applications range from ruggedize and shock hardened electronics, lightweight power distribution systems, and directed energy systems. Commercial applications that would benefit from this thermal management technology range from consumer electronics to LED illumination. Ultimately the improved thermal performance in a variety of systems leads to better reliability and longer lifetime at greatly reduced cost, weight, and size.