SBIR/STTR Research Award
Thermal Ground Planes for High Power Solid-State Lasers
Award amount
$1,498,730Program and phase
SBIR · Phase IIAward year
2015Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- i2C Solutions, LLC
- Proposal award date
- 2015-05-28
- Contract end date
- 2019-08-24
- UEI
- TLQTKMSE5RP7
- Solicitation number
- 2013.2
- Topic code
- MDA13-022
Research abstract
A key challenge toward future directed energy systems is the development of power and thermal management technologies needed to support the laser systems, particularly pump diodes.I2C Solutions and the University of Colorado have developed a Thermal Ground Plane (TGP) technology that interfaces with doide laser bars in order to spread heat and transport it to the laser cooling loop.During Phase II, i2C will develop and demonstrate an initial prototype diode bar array with TGPs integrated for performance improvements and the Phase II program will culminate with a demonstration and evaluation of the prototype by directed energy community leaders.Approved for Public Release 15-MDA-8169 (20 March 15)
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Supersaturated Oxygen Emulsion for Topical Treatment of Ocular Trauma
- Flexible 2-Phase Thermal Strap for Small Sats
- Conformal Thermal Ground Plane for Fiber Amplifier
- Conformal Thermal Ground Plane for Fiber Amplifier
- Conformable Thermal Ground Plane
Research funding history
8 SBIR/STTR records share this UEI (2012–2015). Reported award amounts total $3,022,543. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration