Simultaneous RF Beamforming Phased Array Sensors through Wafer Scale Photonic Integration

ABSTRACT: This SBIR program will take maximum advantage of CMOS foundry based silicon photonics integration and Wavelength Division Multiplexing (WDM) technologies developed for the telecom industry, to create wafer scale photonic integrated circuit (PIC) devices directly integrated with advanced Receive Phased Array Antennas, providing broad instantaneous bandwidth, multi­channel simultaneous beamforming capability. BENEFIT: This SBIR program will lead to a new generation of photonic integrated circuit (PIC) enabled Receive Phased Array Antenna (Rx-PAA) products. The PIC based devices will enable a new generation of advanced Receive Antenna sensors, with unique capabilities not obtainable with electronic only systems, and with significantly lower size, weight and power (SWaP). The Rx-PAA systems will be used for for DoD and commercial applications on unmanned aircraft systems (UASs), as well as on a range of DoD platforms including aircraft, space platforms, ships and land vehicles. Elements of the PIC devices developed during this program will find applications supporting high dynamic range optical links and advanced signal processing of optical signals on a variety of DoD platforms and in commercial systems.