SIGINT Interfaces and Processing Infrastructure for Submarines

This Phase II proposal describes a networking solution that addresses the requirements of next generation SIGINT systems that will be deployed on submarines. The system consists of a multi-protocol, multi-terabit fabric interconnect with reduced size, weight, and power compared to other currently available networking solutions. This system will allow interconnection of the next generation RF digitizers, processing engines, and storage arrays. The fabric interconnect will support both unicast and multicast transmissions, will be managed using software-defined networking (SDN) application programming interfaces (API), and will have in-system firmware and software upgradeability. The Phase II option proposal expands the networking solution to include a VPX-based interconnect interface card (IIC) to install directly into the RF digitizer chassis. This will enable the system to forward digitized RF data to one or more destinations, managed under software control. Combined, the Phase II and Phase II option development will represent the first step in implementing and validating a flexible and scalable multi-protocol multi-terabit fabric for submarine SIGINT and EW systems. Future developments will allow the interconnect fabric to grow to tens of terabits per second, along with additional IICs of varying protocols and form-factors, all without end-system software modification.