MegaFlex Scale-Up Cost & Risk Reduction for >50kW Future Power Demands
Award amount
$124,559Program and phase
SBIR · Phase IAward year
2014Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- ANGSTROM DESIGNS INC
- Proposal award date
- 2014-06-20
- Contract end date
- 2014-12-19
- UEI
- PFJ8LV1Q7SF8
- Solicitation number
- Not reported
- Topic code
- H5.02
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Photovoltaic Thermal Runaway Test Capability for Advanced Space Solar Cells
- Rapid Ultraviolet LED Tester for Space Materials
- 6 Junction Expansion to 3-5 Junction Programmable LED Solar Simulator
- 6 Junction Expansion to 3-5 Junction Programmable LED Solar Simulator
- Modular Embedded Intelligent Sensor Network
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Novel, Functionally Graded Coating System for Reusable, Very High Temperature Applications
- Novel, Functionally Graded PIP Coating System for Hot Structures
- Enabling Technology for Thermal Protection on HIAD and Other Hypersonic Missions
- Metallic Joining to Advanced Ceramic Composites
- Extreme Temperature Stitched Structures
Research funding history
18 SBIR/STTR records share this UEI (2012–2025). Reported award amounts total $8,258,744. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: National Aeronautics and Space Administration, Department of Defense