Electronic Component Fingerprinting to Determine Manufacturing Origin

This program will develop an automated, computer-assisted method for tracking a semiconductor device back to the fab that produced it. To accomplish this goal, we will measure characteristics of the device that are consistent within a given fab toolset, and compare the results to known authentic parts in order to establish a match. This technique will for the first time enable a simple inspection to identify a signature of the fab that created a part, rather than electrical or physical characteristics associated with its performance. This will benefit the military by establishing an unspoofable process with which to validate its supply chain, and will be applicable in civilian anti-counterfeiting applications.