SBIR/STTR Research Award
Electronic Component Fingerprinting to Determine Manufacturing Origin
Award amount
$999,014Program and phase
SBIR · Phase IIAward year
2014Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- FABMETRIX INC
- Proposal award date
- 2014-03-25
- Contract end date
- 2016-03-20
- UEI
- KALUKJ7E3644
- Solicitation number
- 2013.3
- Topic code
- SB133-003
Research abstract
In the area of supply chain integrity improvement, the US defense and intelligence sectors anticipate multiple uses for the forensic capability to characterize an electronic component for the purpose of identifying the semiconductor fabrication facility w
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- CHARGE COLLECTION SCANNING TRANSMISSION ELECTRON MICROSCOPY FOR ADVANCED INFRARED SEMICONDUCTOR DEVICES
- Charge collection scanning transmission electron microscopy for advanced infrared semiconductor devices
- VLWIR HgCdTe FPA Reliability and Yield Enhancement through Nanostructural Analysis
- A Rapid and Cost-Effective Approach to Nanostructural Analysis of Semiconductor Devices
- VLWIR HgCdTe FPA Reliability and Yield Enhancement through Nanostructural Analysis
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Electronic Component Fingerprinting to Determine Manufacturing Origin
- Electronic Component Fingerprinting to Determine Manufacturing Origin
- Electronic Component Fingerprinting to Determine Manufacturing Origin
- Electronic Component Fingerprinting to Determine Manufacturing Origin
Research funding history
7 SBIR/STTR records share this UEI (2009–2020). Reported award amounts total $3,632,270. Reported amounts are not federal obligations.
Phases: Phase II, Phase I
Agencies: Department of Defense